SUNNYVALE, Calif., Aug 04, 2010 (BUSINESS WIRE) —

a leading provider of serial chip-to-chip
communications solutions that deliver unparalleled bandwidth performance
for next generation networking systems and advanced system-on-chip (SoC)
designs, today announced it has partnered with Radiocomp
and GDA
to deliver a complete end to end connectivity solution
focusing on the 3GPP long term evolution (LTE) and 4G cellular base
station component market. MoSys is partnering with Radiocomp to provide
a complete Common Public Radio Interface (CPRI) and Open Base Station
Architecture Initiative (OBSAI) solution and with GDA to provide a
Serial Rapid I/O (SRIO) base-band solution. The combination of CPRI,
OBSAI and SRIO will provide the end customer with a complete end to end
wireless SerDes connectivity solution.

“The proliferation of 3G and 4G enabled wireless devices is creating
exponential growth and demand for greater bandwidth and higher data
rates,” said David DeMaria, vice president of Business Operations at
MoSys. “By teaming up with Radiocomp and GDA, our joint IP solution will
help component designers implement a highly configurable solution that
supports today’s mobile and wireless standards, and ultimately improves
wireless users’ experience by providing faster downloads of data and

The new joint solution is compliant with version 4.1 of the CPRI
specification and version RP3 v4.1 of the OBSAI specification, but is
ready to support future protocol line rate extensions of up to 10 Gbps
using Radiocomp’s market-leading IP, which will provide the high
capacities needed to support the explosive growth in mobile broadband

By partnering to provide proven interoperability, application notes, and
direct engineering assistance, MoSys, Radiocomp, and GDA will help
designers speed time-to-market and reduce cost and risks while improving
customer productivity and cost of ownership. The target market for the
combined MoSys, Radiocomp, and GDA IP solution will be device and
component manufacturers.

“We are experiencing a sharp rise in the demand for easy-to-use,
off-the-shelf, and plug & play CPRI and OBSAI IP core solutions capable
of boosting the bandwidths and data rates of mobile base stations. Our
experience in developing and deploying CPRI & OBSAI-enabled LTE Remote
Radio Heads shows that our IP solutions are fully functional and ready
for use. The joint solution will help customers minimize design efforts,
and greatly accelerate their time to market,” said Christian Lanzani,
Senior Product Manager at Radiocomp.

Mr. Isaac Sundarajan, CEO of GDA Technologies Inc., a fully owned
subsidiary of L&T Infotech, and Executive Vice President of Product
Engineering Services at L&T Infotech, stated, “As industry leaders in
our respective technologies, we are offering customers silicon proven
SIP in Serial RapidIO versions 1.3 and 2.1 uniquely with AXI to Serial
RapidIO with DMA & DME bridging functions for the best solutions
available on the market specifically for the growing Wireless Base
Station SoCs. We are uniquely positioned because we are able to reduce
integration cost and risk, while shortening time-to-market.”

For more information, contact MoSys at

About Radiocomp

Radiocomp is a leading provider of systems and components for next
generation mobile and wireless networks. Radiocomp is the first company
in the world to develop and manufacture state-of-the-art,
fully-software-configurable remote radio heads and components for WiMAX
and LTE radio networks. For more information visit
For sales contact

About GDA Technologies

GDA Technologies is a leading Electronic Design Services (EDS) and
Silicon Intellectual Property (SIP) solution provider for the embedded,
networking, and consumer electronics markets. GDA is a 100% subsidiary
of the L&T Infotech and part of Product Engineering Services (PES)
offerings that aim to provide end-to-end product design capability to
customers. GDA is headquartered in San Jose, CA, with satellite design
centers in Sacramento, Chennai and Bangalore.

About MoSys, Inc.

MoSys, Inc. (NASDAQ: MOSY) is a leading provider of serial chip-to-chip
communications solutions that deliver unparalleled bandwidth performance
for next generation networking systems and advanced system-on-chip (SoC)
designs. MoSys’ Bandwidth Engine(TM) family of ICs combines the company’s
patented 1T-SRAM(R) high-density memory technology with its
high-speed 10 Gigabits per second (Gbps) SerDes interface (I/O)
technology. A key element of Bandwidth Engine technology is the
GigaChip(TM) Interface, an open, CEI-11 compatible interface developed to
enable highly efficient serial chip-to-chip communications. MoSys’ IP
portfolio includes SerDes IP and DDR3 PHYs that support data rates from
1 – 11 Gbps across a variety of standards. In addition, MoSys offers its
flagship, patented 1T-SRAM and 1T-Flash(R) memory cores, which
provide a combination of high-density, low power consumption, high-speed
and low cost advantages for high-performance networking, computing,
storage and consumer/graphics applications. MoSys IP is
production-proven and has shipped in more than 325 million devices.
MoSys is headquartered in Sunnyvale, California. More information is
available on MoSys’ website at

MoSys, 1T-SRAM and 1T-Flash are registered trademarks of MoSys, Inc. The
MoSys logo, Bandwidth Engine and GigaChip are trademarks of MoSys, Inc.
All other marks mentioned herein are the intellectual property of their
respective owners.

SOURCE: MoSys, Inc.

MoSys, Inc.
Media Contact:
Katie Olivier, 972-239-5119 x128
Company Contact:
Kristine Perham, 408-731-1804