Bandwidth Engine 3 serial memory and data accelerator solves fundamental memory bottlenecks in high-speed systems and is now available for industrial temperature ranges
SAN JOSE, Calif., April 24, 2018 (GLOBE NEWSWIRE) — MoSys (NASDAQ:MOSY), a provider of semiconductor solutions that enable fast, intelligent data access for cloud networking, security, test and video systems, today announced the newest members of its Bandwidth Engine 3 (BE3) family that support industrial temperature ranges. Higher speed data processing applications, which require both high access rates and bandwidth to memory, are proliferating in today’s systems, including those operating under challenging environmental conditions, in order to meet the increasing computational and high-speed search demands. The Bandwidth Engine is a proven solution for critical memory access bottlenecks, enabling full system performance capabilities and minimizing board area, pin count, complexity and power. These products introduced by MoSys are the first to support industrial temperatures ranging from -40°C to 85°C.
“Our customers serving communications, networking, security and data center applications have created differentiated systems by leveraging our Bandwidth Engine to solve high-speed memory bottlenecks,” said John Monson, VP of sales and marketing at MoSys. “With our new products, we are able to provide improved performance and board implementation advantages to high-speed applications in both existing and new markets that must meet industrial temperature ranges.”
The Bandwidth Engine 3 family of ICs leverages MoSys’ fundamental patents for serial memory. The devices integrate a large, high access rate internal memory and low pin count serial interconnect and unique off-load technology to accelerate Read-Modify-Write tasks, such as counters. Up to 16 bidirectional serial lanes running up to 15Gb/s per lane can deliver total bandwidth of up to 480Gb/s at the interface using a highly efficient transfer protocol. At 25Gb/s per lane, the interface bandwidth is over 800Mb/s. The internal memory architecture consists of SRAM class memory cells with 3ns tRC and partitioned memory blocks totaling 1Gbit. The solution is optimized for access rates of up to five billion memory transactions per second. The devices deliver industry-leading performance and system benefits to markets and customers that must support increasing computational, statistics and search requirements at higher line rates.
The Bandwidth Engine family has an extensive ecosystem that has proven compatibility across multiple generations of FPGAs offered by both Xilinx and Intel. Memory controller IP, evaluation boards and design-support documentation are available to accelerate implementation time and reduce risk.
MoSys is currently sampling its industrial temperature BE3 devices with serial interfaces ranging from 10Gb to 12.5Gb per lane, and expects to release additional devices with higher interface data rates in the future.
About MoSys, Inc.
MoSys, Inc. (NASDAQ:MOSY) a provider of semiconductor solutions that enable fast, intelligent data access for cloud networking, security, test and video systems. The company’s solutions eliminate data access bottlenecks to deliver speed and intelligence for line cards and systems scaling from 100G to multi-terabits per second. Engineered and built for high-reliability carrier and enterprise applications, MoSys’ Bandwidth Engine® IC product family is based on the company’s patented high-performance, high-density intelligent access and high-speed serial interface technology, and utilizes the company’s highly-efficient GigaChip™ Interface. More information is available at www.mosys.com.
Bandwidth Engine, GigaChip and MoSys are registered trademarks of MoSys, Inc. in the US and/or other countries. The MoSys logo is a trademark of MoSys, Inc. All other marks mentioned herein are the property of their respective owners.
Contacts:John MonsonMoSys, Inc.
+1 (408) 418-7500
Beverly Twing, Sr. Acct. Manager
Shelton Group, Investor Relations
+1 (214) 272-0089