Cells targeted at 0.10-micron logic process already tested
SUNNYVALE, CALIFORNIA and HSINCHU, TAIWAN (November 12, 2001) – MoSys (NASDAQ:MOSY) and Taiwan Semiconductor Manufacturing Company (TSM) today announced that MoSys 1T-SRAM technology has now been verified on multiple versions of TSMC’s 0.13-micron standard and triple-oxide logic processes with excellent yield results.
TSMC is now ready to accept customers’ tapeouts utilizing these 0.13-micron triple-oxide logic processes. MoSys and TSMC further announced verification and excellent test and yield results of 1T-SRAM test memory cells targeted for the 0.10-micron process generation.
MoSys is already in the process of implementing 1T-SRAM memory macros fully adjusted for TSMC’s 0.10-micron optimized logic process.
“As designers move increasingly to system-on-chip methodologies, we see growing customer interest in easily manufacturable embedded high-density memories,” said Genda Hu, Vice President of Marketing at TSMC.
“TSMC has consistently been the first foundry to successfully manufacture 1T-SRAM in mass production and has a strong alliance with MoSys. Starting with 0.13um generation, we are committed to providing a logic process especially optimized for 1T-SRAM.”
Mark-Eric Jones, MoSys’ vice president and general manager of intellectual property commented, “Our close collaboration with TSMC over the last two years in porting and verification of our 1T-SRAM embedded memory macros over five generations of standard logic processes had been extremely successful and productive.
Both TSMC and its customers benefit greatly from the dramatic cost savings and time-to-volume advantages delivered by our embedded 1T-SRAM technology. We will continue our collaboration with TSMC on their most advanced logic processes to provide mutual customers with the best and most complete 1T-SRAM offering at the earliest stage.”
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry industry’s largest portfolio of process-proven library, IP, design tools and reference flows.
The company operates two advanced 300mm wafer fabs, seven eight-inch fabs and two six-inch wafer fabs. TSMC also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC) and at its wholly-owned subsidiary, WaferTech.
In early 2001, TSMC became the first IC manufacturer to announce a 0.10-micron technology alignment program with its customers. TSMC’s corporate headquarters are in Hsin-Chu, Taiwan. For more information about TSMC please go to http://www.tsmc.com.
Founded in 1991, MoSys develops, licenses and markets innovative memory technology for semiconductors. MoSys’ patented 1T-SRAM technology offers a combination of high density, low power consumption, high speed and low cost unmatched by other available memory technologies.
The single transistor bit cell used in 1T-SRAM technology results in the technology achieving much higher density than traditional four or six transistor SRAMs while using the same standard logic manufacturing processes.
1T-SRAM technology also offers the familiar, refresh-free interface and high performance for random address access cycles associated with traditional SRAMs. In addition, this technology can reduce operating power consumption by a factor of four compared with traditional SRAM technology, contributing to making it an ideal technology for embedding large memories in System on Chip (SoC) designs.
1T-SRAM technology is in volume production both in SoC products at MoSys’ licensees as well as in MoSys standalone memories.
MoSys is headquartered at 1020 Stewart Drive, Sunnyvale, California 94085. More information is available on MoSys’ website at http://www.mosys.com.
Note for Editors:
1T-SRAM® is a MoSys trademark registered in the U.S. Patent and Trademark Office.
All other trademarks or registered trademarks are the property
of their respective owners.