WALTHAM, Mass. and SUNNYVALE, Calif. (May 24, 1999)— Lexra,
a leading developer of processor cores for embedded applications,
and MoSys, a premier supplier of leading-edge memory products and
licensable memory cores, today announced a partnership to jointly
market Lexra’s RISC and DSP cores with MoSys’ embedded SRAM for
System-On-Chip (SOC) designs. The companies will jointly produce
a test chip that contains Lexra’s ¹LX5280 RISC-DSP core and MoSys’
Embedded RISC processors and DSPs need increasingly large amounts
of on-chip memory, but must remain within a tight power consumption
and die size budget. By combining Lexra’s 32-bit RISC and DSP cores
with MoSys’ ultra-high density, low power 1T-SRAM, SOC designers
can achieve unprecedented performance with very low power consumption
and small die area. The Lexra-MoSys test chip, which will combine
Lexra’s LX5280 RISC-DSP core with 2Mbits of MoSys’ 1T-SRAM, will
be fabricated on a 0.18-micron process at a mutual foundry partner.
“We are excited to be working with Lexra,” stated Mark-Eric
Jones, vice president and general manager, intellectual property
at MoSys. “Lexra¹s leading RISC-DSP core and MoSys’ unique
1T-SRAM memory each achieve industry-leading performance, die area
and power consumption characteristics. Combined, they represent
an outstanding embedded solution for customers.”
“We’re pleased to partner with MoSys, a leader in memory
technology,” said Charlie Cheng, president and CEO of Lexra.
“This test chip will demonstrate to our customers a highly
compelling channel for delivering innovative DSP and other embedded
The 0.18-micron test chip will be available to mutual licensees
of Lexra and MoSys in Q1, 2000. It will include the LX5280 plus
2Mbits of 1T-SRAM, organized as 128KB of instruction RAM and 128KB
of data RAM. The chip will run at speeds of 200MHz to 266MHz, with
a die size of less than 36mm2 and power consumption of less than
Lexra’s family of RISC and DSP cores lead the industry in ease-of-use
and portability, while comparing favorably to industry leaders in
performance, die size and power consumption. The LX5280 32-bit RISC-DSP
core executes the MIPS I® instruction set* and Lexra’s RADIAXTM
DSP extension, and delivers performance of 400 MMACs (Million Multiply-Accumulate
instructions per second).
MoSys’ innovative 1T-SRAM offers one-third the die size and one-fourth
the power consumption of other leading-edge SRAM technologies, and
can be implemented on standard logic semiconductor processes.
Lexra, Inc. is a leading microprocessor developer specializing
in RISC and DSP cores for the embedded market. In addition to competitive
performance, small die size and low power consumption, Lexra’s processor
cores are also easy to use, easy to port and provide customers with
cost effective solutions. Lexra is headquartered in Waltham, MA.
Further information can be found at http://www.lexra.com.
MoSys, Inc. is a semiconductor memory technology company that specializes
in innovative, high performance, random access memories including
products based on its patented 1T-SRAM technology. Founded in 1991,
the Company develops and markets memory integrated circuits as well
as licenses memory technology and cores to semiconductor and systems
companies. The Company is headquartered at 1020 Stewart Drive, Sunnyvale,
California 94086. More information on MoSys is available at https://dev-mosys-web-04-19.pantheonsite.io.
*MIPS, MIPS I, MIPS16, R3000, and other MIPS common
law marks are trademarks and/or registered trademarks of MIPS Technologies,
Inc. Lexra, Inc. is not associated with MIPS Technologies, Inc.
in any way. Unaligned loads & stores are not supported in hardware.